Product Description
This Heat Sink RTV is a thermally conductive silicone RTV adhesive widely used in heat sink applications. It is a silicone thermal conductive paste that stick to the substrates and transfer heat of the bonded assembly in no time. This is resistant to heat, cold and moisture ensuring to provide the best performance. In addition, this Heat Sink RTV is also available with UV, ozone and fire resistant properties.
Specification
| Material | Aluminium |
| Usage/Application | Industrial |
| Heatsink Size | Standard |
| Fin Style | Round Fin |
| Color | White |
Excellent Thermal and Electrical PerformanceWith a thermal conductivity of 1.2 W/mK and an impressive dielectric strength of 18 kV/mm, Heat Sink RTV provides superior thermal dissipation and insulation in a diverse range of electronic assemblies. The compound is formulated for high gap filling and spreading control, making it ideal for applications where interface efficiency is crucial.
Fast Room-Temperature CuringThis RTV silicone cures quickly at room temperature, reaching a tack-free state in approximately 10-20 minutes, and full cure in under 30 minutes. This minimizes downtime during assembly and enables fast, efficient processing when bonding heat sinks or thermal devices.
Adaptable Packaging and ApplicationHeat Sink RTV is available in syringes, tubes, or bulk packaging, accommodating both small-scale and industrial requirements. Custom colors, widths, and thicknesses are available, ensuring the compound fits precisely with your applications technical and aesthetic needs.
FAQs of Heat Sink RTV:
Q: How is Heat Sink RTV applied for optimal thermal and adhesive performance?
A: The compound should be applied directly to clean, dry surfaces where heat dissipation or thermal transfer is required. Spread a thin, even layer to maximize both gap filling and contact with components before pressing the surfaces together.
Q: What are the main benefits of using Heat Sink RTV in electronic hardware assembly?
A: Heat Sink RTV combines effective heat dissipation, strong electrical insulation, excellent moisture resistance, and rapid curing. It adheres well to most substrates, providing long-term stability and extending the life of electronic assemblies.
Q: When will Heat Sink RTV be tack-free and fully cured after application?
A: At room temperature, the compound becomes tack-free within 10-20 minutes, with full cure typically reached in under 30 minutes, making it ideal for fast-paced production environments.
Q: Where can I use Heat Sink RTV for maximum efficiency?
A: This compound is ideal for use in thermal interface applications, heat sink jointing, and the assembly of electronic components where efficient thermal transfer and gap filling are requiredsuch as CPUs, power modules, and LED assemblies.
Q: What is the recommended process for storing Heat Sink RTV and what is its shelf life?
A: Store the compound in its original, unopened packaging in a cool, dry place. The shelf life is 12 months from the date of manufacture, ensuring reliability and performance if properly stored.
Q: Can packaging and product specifications of Heat Sink RTV be customized?
A: Yes, Heat Sink RTV is offered in syringes, tubes, standard packs (100 gm, 250 gm, 1 kg), and bulk for large-scale needs. Custom colors, widths, thicknesses, and packaging sizes are available to suit specific project requirements.